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Park NX-3DM

Automated Industrial AFM for High-Resolution 3D Metrology

The innovative Park 3DM, an automated AFM system, excels in overhang profiles, sidewall imaging, and critical angle measurements with its unique decoupled XY and Z scanning and a tilted Z-scanner. It effectively addresses the limitations of normal and flare tip methods in sidewall analysis. The system's True Non-Contact Mode™ allows for non-destructive measurement of soft photoresist surfaces using high aspect ratio tips.

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Innovation and Efficiency for 3D Metrology

Park Systems has introduced the revolutionary Park 3DM Series, the completely automated AFM system designed for overhang profiles, high-resolution sidewall imaging, and critical angle measurements. With the patented decoupled XY and Z scanning system with tilted Z-scanner, it overcomes the challenges of the normal and flare tip methods in accurate sidewall analysis. In utilizing our True Non-Contact Mode™, the Park 3DM Series enables non-destructive measurement of soft photoresist surfaces with high aspect ratio tips.

Park Systems has introduced the revolutionary Park 3DM Series, the completely automated AFM system designed for overhang profiles, high-resolution sidewall imaging, and critical angle measurements. With the patented decoupled XY and Z scanning system with tilted Z-scanner, it overcomes the challenges of the normal and flare tip methods in accurate sidewall analysis. In utilizing our True Non-Contact Mode™, the Park 3DM Series enables non-destructive measurement of soft photoresist surfaces with high aspect ratio tips.

Automatic Measurement Control for Increased Efficiency

  • Innovative Z-Scan System

    The many unique features of the NX-3DM are made possible by independently tilting the Z-scanner in its patented Crosstalk Eliminated platform, where XY and Z scanners are completely decoupled. This design allows users to access the vertical sidewalls as well as the under cut structures at various angles. Unlike in systems with flared tips, here high resolution and high aspect ratio probes can be used.

    Innovative Z-Scan System

  • Sidewall Roughness Measurement

    The NX-3DM’s innovative head tilting design allows access to the sidewalls using an ultra sharp tip to obtain high resolution, well-defined details of the area and its roughness. Innovative head tilting design allows access to the sidewalls using ultra sharp tip to obtain high resolution and(more defined)details of the side wall roughness.

    Sidewall Roughness Measurement

  • Critical Dimension Measurement

    The True Non-contact mode enables instrument and subject-preserving CD measurement without sacrificing image fidelity.

    Critical Dimension Measurement

Full Automation

Park NX-3DM is a clean-room-compatible, fully automated nanoscale measurement and analysis system that utilizes NX technology to construct highly accurate topographical images and gather crucial dimensional data. Its industry-leading low noise Z-detector operates on an independent, closed loop to minimize errors in topography, mitigating the "creep effect." With its True Non-contact™ mode, it enables the collection of high-resolution and precise data without risking tip-sample damage, thereby saving valuable time and resources that could otherwise be lost to costly repairs or adjustments.

Innovative Head Design

The Z-head's distinctive sideways orientation in Park NX-3DM facilitates access to undercut and overhang structures in materials like photoresist, while its patented decoupled XY and Z scanning systems, coupled with the tilted Z-scanner, empower users to overcome challenges in accurate sidewall analysis typically associated with conventional methods. This system enables measurement of sidewall trench line profiles, roughness, critical angle, and critical dimensions. Moreover, the Z-head's tilting mechanism facilitates access to sidewalls using an ultra-sharp tip, ensuring the same high resolution and definition obtained over the rest of the material

Seamless 3D Material Measurement

In the process facilitated by Park NX-3DM, no sample preparation such as cutting, mounting, or coating is necessary to obtain measurements of sidewall roughness or critical dimensions. This efficiency is achieved through the utilization of Z-head tilting and True Non-contact™ mode, enabling both tip-preserving and high-resolution collection of sidewall data.

Applications

Perfect for Diverse Applications